A review of integrated applications of BIM and related technologies in whole building life cycle

Qingfeng Meng, Yifan Zhang, Zhen Li, Weixiang Shi, Jun Wang, Yanhui Sun, Li Xu, Xiangyu Wang

Research output: Contribution to journalArticlepeer-review

77 Citations (Scopus)

Abstract

Purpose –The purpose of this paper is to summarize the current applications of BIM, the integration of related technologies and the tendencies and challenges systematically. Design/methodology/approach – Using quantitative and qualitative bibliometric statistical methods, the current mode of interaction between BIM and other related technologies is summarized. Findings – This paper identified 24 different BIM applications in the life cycle. From two perspectives, the implementation status of BIM applications and integrated technologies are respectively studied. The future industry development framework is drawn comprehensively. We summarized the challenges of BIM applications from the perspectives of management, technology and promotion, and confirmed that most of the challenges come from the two driving factors of promotion and management. Research limitations/implications – The technical challenges reviewed in this paper are from the collected literature we have extracted, which is only a part of the practical challenges and not comprehensive enough. Practical implications – We summarized the current mode of interactive use of BIM and sorted out the challenges faced by BIM applications to provide reference for the risks and challenges faced by the future industry. Originality/value – There is little literature to integrate BIM applications and to establish BIM related challenges and risk frameworks. In this paper, we provide a review of the current implementation level of BIM and the risks and challenges of stakeholders through three aspects of management, technology and promotion.
Original languageEnglish
Pages (from-to)1647-1677
Number of pages31
JournalEngineering, Construction and Architectural Management
Volume27
Issue number8
DOIs
Publication statusPublished - 2020

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