Analytical solution for the bond strength of externally bonded reinforcement

Yu Fei Wu, Xin Sheng Xu, Jia Bin Sun, Cheng Jiang

Research output: Contribution to journalArticlepeer-review

107 Citations (Scopus)

Abstract

Interfacial behavior is critical to composite structures and materials reinforced by externally bonded reinforcement. Numerous empirical and semi-empirical models have been developed for evaluating interfacial bond strength. Analytical solutions have been derived for interfaces with infinite bond lengths, but no closed-form solutions have been derived for the bond strength of an interface with an arbitrary bond length. An analytical solution is derived in this work for the strength of a general externally bonded interface. With the analytical method, the interesting snapback phenomenon in simple pull-off tests is theoretically studied, and an invariant is identified as the condition for it to occur. Furthermore, a methodology is provided to evaluate the interfacial material properties based on a given empirical bond model.

Original languageEnglish
Pages (from-to)3232-3239
Number of pages8
JournalCompos. Struct.
Volume94
Issue number11
DOIs
Publication statusPublished - Nov 2012
Externally publishedYes

Keywords

  • Adhesion
  • Analytical modeling
  • Debonding
  • Interface

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