Capacitive sensor based 2D subsurface imaging technology for non-destructive evaluation of building surfaces

Lasitha Piyathilaka, Basuru Sooriyaarachchi, Sarath Kodagoda, Karthick Thiyagarajan

Research output: Chapter in Book / Conference PaperConference Paperpeer-review

8 Citations (Scopus)

Abstract

Understanding the underlying structure of building surfaces like walls and floors is essential when carrying out building maintenance and modification work. To facilitate such work, this paper introduces a capacitive sensor based technology which can conduct non-destructive evaluation of building surfaces. The novelty of this sensor is that it can generate a real-time 2D subsurface image which can be used to understand structure beneath the top surface. Finite Element Analysis (FEA) simulations are done to understand the best sensor head configuration that gives optimum results. Hardware and software components are custom-built to facilitate real-time imaging capability. The sensor is validated by laboratory tests, which revealed the ability of the proposed capacitive sensing technology to see through common building materials like wood and concrete. The 2D image generated by the sensor is found to be useful in understanding the subsurface structure beneath the top surface.
Original languageEnglish
Title of host publicationProceedings of the IEEE 2019 9th International Conference on Cybernetics and Intelligent Systems (CIS), Robotics, Automation and Mechatronics (RAM), 18 - 20 November 2019, Bangkok, Thailand
PublisherIEEE
Pages287-292
Number of pages6
ISBN (Print)9781728134581
DOIs
Publication statusPublished - 2019
EventIEEE International Conference on Cybernetics and Intelligent Systems -
Duration: 1 Jan 2019 → …

Conference

ConferenceIEEE International Conference on Cybernetics and Intelligent Systems
Period1/01/19 → …

Fingerprint

Dive into the research topics of 'Capacitive sensor based 2D subsurface imaging technology for non-destructive evaluation of building surfaces'. Together they form a unique fingerprint.

Cite this