Abstract
This paper investigates the fracture problem of a piezoelectric cylinder with a periodic array of embedded circular cracks. An electro-mechanical fracture mechanics model is established first. The model is further used to the thermal fracture analysis of a piezoelectric cylinder subjected to a sudden heating on its outer surface. The temperature field and the associated thermal stresses and electric displacements are obtained and are added to the crack surface to form a mixed-mode boundary value problem for the electro-mechanical coupling fracture. The stress and stress intensities are investigated for the effect of crack spacing. Strength evaluation of piezoelectric materials under the transient thermal environment is made and thermal shock resistance of the medium is given.
Original language | English |
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Pages (from-to) | 2126-2145 |
Number of pages | 20 |
Journal | International Journal of Solids and Structures |
Volume | 43 |
Issue number | 45511 |
DOIs | |
Publication status | Published - 2006 |
Keywords
- fracture mechanics
- piezoelectric materials
- thermal stresses