Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

A. B. Zhang, B. L. Wang

    Research output: Contribution to journalArticlepeer-review

    10 Citations (Scopus)

    Abstract

    Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.
    Original languageEnglish
    Pages (from-to)205-209
    Number of pages5
    JournalTheoretical and Applied Fracture Mechanics
    Volume80
    Issue numberPart B
    Publication statusPublished - Dec 2015

    Bibliographical note

    Publisher Copyright:
    © 2015 Elsevier Ltd.

    Keywords

    • fracture mechanics
    • piezoelectric materials

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