Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

A. B. Zhang; B. L. Wang

doi:10.1016/j.tafmec.2015.08.002

Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

Research output: Contribution to journal › Article › peer-review

Abstract

Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.

Original language	English
Pages (from-to)	205-209
Number of pages	5
Journal	Theoretical and Applied Fracture Mechanics
Volume	80
Issue number	Part B
DOIs	https://doi.org/10.1016/j.tafmec.2015.08.002
Publication status	Published - 2015

Keywords

fracture mechanics
piezoelectric materials

Access to Document

10.1016/j.tafmec.2015.08.002

Cite this

@article{cc11f7d500f64b7896375bcb3cbb0fc6,

title = "Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials",

abstract = "Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.",

keywords = "fracture mechanics, piezoelectric materials",

author = "Zhang, {A. B.} and Wang, {B. L.}",

year = "2015",

doi = "10.1016/j.tafmec.2015.08.002",

language = "English",

volume = "80",

pages = "205--209",

journal = "Theoretical and Applied Fracture Mechanics",

issn = "0167-8442",

publisher = "Elsevier",

number = "Part B",

}

TY - JOUR

T1 - Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

AU - Zhang, A. B.

AU - Wang, B. L.

PY - 2015

Y1 - 2015

N2 - Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.

AB - Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.

KW - fracture mechanics

KW - piezoelectric materials

UR - http://handle.uws.edu.au:8081/1959.7/uws:32183

U2 - 10.1016/j.tafmec.2015.08.002

DO - 10.1016/j.tafmec.2015.08.002

M3 - Article

SN - 0167-8442

VL - 80

SP - 205

EP - 209

JO - Theoretical and Applied Fracture Mechanics

JF - Theoretical and Applied Fracture Mechanics

IS - Part B

ER -

Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this