Effect of Maxwell stresses on the thermal crack tip field for piezoelectric materials

A. B. Zhang, B. L. Wang

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

Influence of Maxwell stresses acting upon crack faces on the fracture mechanics problem in piezoelectric materials subjected to thermal, mechanical and electric loads at infinity is investigated theoretically. The thermoelectric semi-permeable crack boundary condition is used. Explicit and closed-form solutions of thermal flux and electric displacement inside the crack, and stress and electric displacement intensity factors are derived based on the Stroh's formalism and thermoelectroelastic Green's function method. Numerical results are given to illustrate the effect of Maxwell stresses on the thermal stress intensity factor when the interior of the crack is filled with different dielectric medium.
Original languageEnglish
Pages (from-to)205-209
Number of pages5
JournalTheoretical and Applied Fracture Mechanics
Volume80
Issue numberPart B
Publication statusPublished - Dec 2015

Bibliographical note

Publisher Copyright:
© 2015 Elsevier Ltd.

Keywords

  • fracture mechanics
  • piezoelectric materials

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