Electrodeposition behaviors of Zn-Ni alloy on copper foil with carrier

Gengfeng Deng, Qinghua Zeng, Jueqi Huang

    Research output: Chapter in Book / Conference PaperConference Paperpeer-review

    Abstract

    ![CDATA[Zn-Ni alloy is a promising peeling layer of ultra-thin copper foil with carrier support due to its good binding properties with copper matrix. We present here our recent work on the electrodeposition behaviors of Zn-Ni alloy peeling layer on ultra-thin copper foil with carrier support by cyclic voltammetry and chronoamperometry. The results show that in pyrophosphate solution the deposition of Zn-Ni alloy on copper foil is a normal co-deposition, the deposition processes start with the deposition of nickel on carrier copper foil, followed by the co-deposition of zinc-nickel upon the reach of zinc deposition potential. Moreover, such deposition is a quasi-reversible process controlled by diffusion and the nucleation of Zn-Ni alloy follows a three-dimensional instantaneous nucleation model.]]
    Original languageEnglish
    Title of host publicationProceedings of the 5th International Conference on Advanced Engineering Materials and Technology (ICAEMT 2015), 22-23 August 2015, Guangzhou, China
    PublisherAtlantis Press
    Pages423-428
    Number of pages6
    ISBN (Print)9789462521087
    Publication statusPublished - 2015
    EventInternational Conference on Advanced Engineering Materials and Technology -
    Duration: 22 Aug 2015 → …

    Publication series

    Name
    ISSN (Print)2352-5401

    Conference

    ConferenceInternational Conference on Advanced Engineering Materials and Technology
    Period22/08/15 → …

    Keywords

    • alloy plating
    • zinc
    • nickel
    • copper

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