@inproceedings{bf4c1e48d657481b8ef39a1f08894d0a,
title = "Electrodeposition behaviors of Zn-Ni alloy on copper foil with carrier",
abstract = "Zn-Ni alloy is a promising peeling layer of ultra-thin copper foil with carrier support due to its good binding properties with copper matrix. We present here our recent work on the electrodeposition behaviors of Zn-Ni alloy peeling layer on ultra-thin copper foil with carrier support by cyclic voltammetry and chronoamperometry. The results show that in pyrophosphate solution the deposition of Zn-Ni alloy on copper foil is a normal co-deposition{\"i}¼{\OE} the deposition processes start with the deposition of nickel on carrier copper foil, followed by the co-deposition of zinc-nickel upon the reach of zinc deposition potential. Moreover, such deposition is a quasi-reversible process controlled by diffusion and the nucleation of Zn-Ni alloy follows a three-dimensional instantaneous nucleation model.",
keywords = "alloy plating, zinc, nickel, copper",
author = "Gengfeng Deng and Qinghua Zeng and Jueqi Huang",
year = "2015",
language = "English",
isbn = "9789462521087",
publisher = "Atlantis Press",
pages = "423--428",
booktitle = "Proceedings of the 5th International Conference on Advanced Engineering Materials and Technology (ICAEMT 2015), 22-23 August 2015, Guangzhou, China",
note = "International Conference on Advanced Engineering Materials and Technology ; Conference date: 22-08-2015",
}