Enhanced fatigue performance of auxetic honeycomb/substrate structures under thermal cycling

This paper studies the fatigue behavior of auxetic honeycomb layer/substrate structures due to interfacial delamination damage. First, the interfacial thermal stress and cyclic interfacial thermal stress intensity factor (ITSIF) at the free ends of the structure are determined in terms of the thermal shock time, relative density, aspect ratio, and internal cell angle of the honeycomb. Then, a theoretical model for the service life analysis of the structures is established based on Paris's law. The results show that the auxetic structures have a lower ITSIF level and a longer service life compared with those of the non-auxetic structures. Another interesting finding is that a reduction in the relative density of the honeycomb layer will increase the service life of the structures. This confirms the significance of applying auxetic materials in re-usable structures for thermal protection purposes. This research is the first attempt to evaluate the service life of the auxetic honeycomb layer/substrate structures under thermal cycling.