Fracture of a finite piezoelectric layer with a penny-shaped crack

B. L. Wang, Y. G. Sun, Y. Zhu

    Research output: Contribution to journalArticlepeer-review

    20 Citations (Scopus)

    Abstract

    This paper studies a penny-shaped crack in a finite thickness piezoelectric material layer. The piezoelectric medium is subjected to a thermal flux on its top and bottom surfaces. Both thermally insulated crack and heated crack are considered. Numerical solution for the finite layer thickness is obtained through the solution of a pair of dual integral equations. The result reduces to the closed form solution when the thickness of the piezoelectric layer becomes infinite. Exact expressions for the stress and electric displacement at the crack border are given as a function of the stress intensity factor, which is determined by the applied thermal flux. This paper is useful for the reliability design of piezoelectric materials in thermal environments.
    Original languageEnglish
    Pages (from-to)19-39
    Number of pages21
    JournalInternational Journal of Fracture
    Volume172
    Issue number1
    DOIs
    Publication statusPublished - 2011

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