New considerations for the fracture of piezoelectric materials under electromechanical loading

B. L. Wang, J. C. Han, S. Y. Du

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)

Abstract

The fracture mechanics problem for a finite height piezoelectric medium under inplane electromechanical loading was studied. This problem was reduced to the solution of singular integration equations by using the Fourier transforms technique. Numerical results demonstrate the effects of crack size and crack position on the stress and electric displacement intensity factors for different crack face boundary condition assumptions.
Original languageEnglish
Pages (from-to)435-444
Number of pages10
JournalMechanics Research Communications
Volume27
Issue number4
DOIs
Publication statusPublished - 2000

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