New considerations for the fracture of piezoelectric materials under electromechanical loading

B. L. Wang; J. C. Han; S. Y. Du

doi:10.1016/S0093-6413(00)00115-4

New considerations for the fracture of piezoelectric materials under electromechanical loading

B. L. Wang, J. C. Han, S. Y. Du

Research output: Contribution to journal › Article › peer-review

19 Citations (Scopus)

Abstract

The fracture mechanics problem for a finite height piezoelectric medium under inplane electromechanical loading was studied. This problem was reduced to the solution of singular integration equations by using the Fourier transforms technique. Numerical results demonstrate the effects of crack size and crack position on the stress and electric displacement intensity factors for different crack face boundary condition assumptions.

Original language	English
Pages (from-to)	435-444
Number of pages	10
Journal	Mechanics Research Communications
Volume	27
Issue number	4
DOIs	https://doi.org/10.1016/S0093-6413(00)00115-4
Publication status	Published - 2000

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title = "New considerations for the fracture of piezoelectric materials under electromechanical loading",

abstract = "The fracture mechanics problem for a finite height piezoelectric medium under inplane electromechanical loading was studied. This problem was reduced to the solution of singular integration equations by using the Fourier transforms technique. Numerical results demonstrate the effects of crack size and crack position on the stress and electric displacement intensity factors for different crack face boundary condition assumptions.",

author = "Wang, {B. L.} and Han, {J. C.} and Du, {S. Y.}",

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AU - Wang, B. L.

AU - Han, J. C.

AU - Du, S. Y.

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N2 - The fracture mechanics problem for a finite height piezoelectric medium under inplane electromechanical loading was studied. This problem was reduced to the solution of singular integration equations by using the Fourier transforms technique. Numerical results demonstrate the effects of crack size and crack position on the stress and electric displacement intensity factors for different crack face boundary condition assumptions.

AB - The fracture mechanics problem for a finite height piezoelectric medium under inplane electromechanical loading was studied. This problem was reduced to the solution of singular integration equations by using the Fourier transforms technique. Numerical results demonstrate the effects of crack size and crack position on the stress and electric displacement intensity factors for different crack face boundary condition assumptions.

UR - http://handle.westernsydney.edu.au:8081/1959.7/uws:46975

UR - http://www.scopus.com/inward/record.url?scp=0034223948&partnerID=8YFLogxK

U2 - 10.1016/S0093-6413(00)00115-4

DO - 10.1016/S0093-6413(00)00115-4

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VL - 27

SP - 435

EP - 444

JO - Mechanics Research Communications

JF - Mechanics Research Communications

IS - 4

ER -

New considerations for the fracture of piezoelectric materials under electromechanical loading

Abstract

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