TY - JOUR
T1 - Noncovalent modification of boron nitrite nanosheets for thermally conductive, mechanically resilient epoxy nanocomposites
AU - Meng, Qingshi
AU - Han, Sensen
AU - Liu, Tianqing
AU - Ma, Jian
AU - Ji, Shude
AU - Dai, Jiabin
AU - Kang, Hailan
AU - Ma, Jun
PY - 2020
Y1 - 2020
N2 - Due to the rapid development of modern micro/nano electronic devices, polymer nanocomposites of high mechanical performance, and thermal conductivity and stability are increasingly important. We herein report a two-step process for preparation of ∼3 nm-thick boron nitride (BN) nanosheets through noncovalent modification by a surfactant Triton X-100, which improves the compatibility of the nanosheets with the matrix as well as their dispersion. TEM micrographs demonstrated that the modified BN nanosheets (m-BN) were relatively uniformly dispersed in epoxy matrix and some were connected with each other. At 2.14 vol % of m-BN, the glass-transition temperature (Tg) and adhesive toughness of neat epoxy were improved by 17% and 355%, respectively. At 4.93 vol %, the thermal conductivity of neat epoxy was remarkably increased to 0.65 W· m−1·k−1, an increment of 335%. In addition, the epoxy/m-BN nanocomposites exhibited high thermal stability, which holds a potential as thermal interface materials for the next generation of electronic devices.
AB - Due to the rapid development of modern micro/nano electronic devices, polymer nanocomposites of high mechanical performance, and thermal conductivity and stability are increasingly important. We herein report a two-step process for preparation of ∼3 nm-thick boron nitride (BN) nanosheets through noncovalent modification by a surfactant Triton X-100, which improves the compatibility of the nanosheets with the matrix as well as their dispersion. TEM micrographs demonstrated that the modified BN nanosheets (m-BN) were relatively uniformly dispersed in epoxy matrix and some were connected with each other. At 2.14 vol % of m-BN, the glass-transition temperature (Tg) and adhesive toughness of neat epoxy were improved by 17% and 355%, respectively. At 4.93 vol %, the thermal conductivity of neat epoxy was remarkably increased to 0.65 W· m−1·k−1, an increment of 335%. In addition, the epoxy/m-BN nanocomposites exhibited high thermal stability, which holds a potential as thermal interface materials for the next generation of electronic devices.
KW - boron nitride
KW - nanocomposites (materials)
KW - thermal conductivity
UR - http://hdl.handle.net/1959.7/uws:57951
U2 - 10.1021/acs.iecr.0c03133
DO - 10.1021/acs.iecr.0c03133
M3 - Article
SN - 0888-5885
VL - 59
SP - 20701
EP - 20710
JO - Industrial and Engineering Chemistry Research
JF - Industrial and Engineering Chemistry Research
IS - 47
ER -