Simulation of controlled modulus column installation using a large deformation finite element analysis

T. Amarathunga, D. S. Liyanapathirana, W. Fuentes, C. J. Leo, P. Hu

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1 Citation (Scopus)

Abstract

Controlled modulus columns (CMC) are widely used in ground improvement techniques where grout columns are constructed by penetrating an auger into the ground using the displacement approach. Numerical simulation of this problem is challenging owing to the large soil deformations associated with installation. Small strain-based finite element analysis procedures available in commercial finite element modeling software are unsuitable for simulating this problem because they cannot simulate large soil deformations around the auger during column installation. Hence, this study presents a numerical approach based on the finite element method to simulate the installation of CMCs. The numerical modeling technique adopted in this study considers large soil deformations around columns during penetration, and the proposed approach is based on remeshing and interpolation techniques. This method was developed using the Python development environment (PDE) within the ABAQUS/standard finite element program. It can penetrate columns below the ground surface without causing large mesh distortions. In this study, silty sand-type soil was considered; hence, the constitutive behavior was simulated using the Mohr-Coulomb criteria. The load-carrying capacity of a controlled modulus column was predicted and compared with an empirical equation based on the cone penetration resistance. The influence zone and failure mechanism of the soil during installation were determined by considering the stress distribution and soil flow pattern around the column.
Original languageEnglish
Article number012005
JournalIOP Conference Series: Earth and Environmental Science
Volume1336
Issue number1
DOIs
Publication statusPublished - 2024
Event5th GeoShanghai International Conference, GeoShanghai 2024 - Shanghai, China
Duration: 26 May 202429 May 2024

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© Published under licence by IOP Publishing Ltd.

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