Solvothermal approach for low temperature deposition of aluminium oxide thin films

XiaoFei Duan, Nguyen H. Tran, Nicholas K. Roberts, Robert N. Lamb

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

At elevated pressure, stoichiometric and high quality Al2O3 thin films are fabricated at 65-105 °C. By using pre-organised single source precursor aluminium(III) diisopropylcarbamate, Al2O3 were deposited on the surface of a Si substrate in a single step in the liquid phase. Comprehensive removal of large carbamate ligands by proposed β-elimination during decomposition of precursor led to an effective delivery of enshrouded Al-O fragments. Scanning electron microscopy revealed dense and grainy surface morphology. The thicknesses of the films were measured to be 150-300 nm and independent to reaction temperatures or reaction times. Through the use of near edge X-ray absorption fine structure spectroscopy, Al absorption peaks suggest a short range crystalline formation in a film deposited at 105 °C.
Original languageEnglish
Pages (from-to)4290-4293
Number of pages4
JournalThin Solid Films
Volume518
Issue number15
DOIs
Publication statusPublished - 2010

Keywords

  • thin films

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