The peeling behavior of film/substrate systems with periodic and discontinuous bonding

Discontinuous bonding is a common adhesion state in multilayer structures within the shipbuilding, automotive, and semiconductor industries, as well as in biological adhesion. Based on the cohesive theory and the Euler-Bernoulli beam model, we investigate the peeling behavior of a film from the rigid substrate subjected to periodic and discontinuous bonding. Different from the continuous bonding model, the peeling force during the peeling process exhibits repeated fluctuations. The increase and decrease of peeling force correspond respectively to the initiation of cohesive zones within the non-bonded and bonded segments. Furthermore, the bonding state at the crack tip influences the change pace of the energy release rate. Specifically, when the cohesive zone initiates within a bonded segment, the decrease in the energy release rate accelerates noticeably as the crack tip enters a non-bonded segment. Additionally, the influence of diverse bonding ratios and varying periodic lengths is discussed. This paper provides insights into the peeling behavior under discontinuous bonding effects in nature, and offers potential applications for the optimization and design of multilayer structures.