Thermal effects on the structural response of planar serpentine interconnects

Z. G. Yan, B. L. Wang, K. F. Wang

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

Serpentine-shaped interconnects are widely employed to achieve high level of stretchability in stretchable electronic devices. In the current work, an analytical model for the mechanical response of planar serpentine interconnects with thermal effect is developed and verified by finite element method (FEM). Specifically, the closed-formed expressions to compliance and stretchability are derived based on curved beam theory and energy method. The numerical results indicate that a considerable error (e.g., >10% relatively) could be induced for many representative configurations using the model with thermal loads absent. The present work provides more accurate predictions for the structural response of serpentine interconnects in practical working conditions, which help in optimal design in future applications.
Original languageEnglish
Pages (from-to)23-30
Number of pages8
JournalInternational Journal of Mechanical Sciences
Volume135
DOIs
Publication statusPublished - 2018

Keywords

  • finite element method
  • mechanical properties
  • serpentine
  • silicate minerals

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