Thermal shock resistance and thermal fracture of a thermopiezoelectric cylinder based on hyperbolic heat conduction

Dongmei Chang, Xuefeng Liu, Baolin Wang, Quan Wang, Tiegang Wang, Jianxin Han

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

Accurate evaluation of the thermal shock resistance is great importance when estimating both the life and the performance of piezoelectric structures under thermal shock load. Non-Fourier heat conduction law assumed that the speed of heat propagation in a body is finite, which is more exact to evaluate the thermal shock resistance when the thermal shock time reduces to ps/fs scale or the length size of materials reduces to micro/nanoscale. A hyperbolic heat conduction equation was used to study the thermal shock resistance of a cylindrical piezoelectric structure, in which a permeable penny-shaped crack is considered. The analytical solution of non-Fourier temperature filed is determined by the method of separated variable. The formulas of the associating thermal stress and electrical displacement in the piezoelectric cylinder without crack were obtained. The crack problem is solved by the Dual integral equation and Abel integral equation. The thermal shock resistance is evaluated by associating the stress-based and fracture mechanics-based failure criteria.
Original languageEnglish
Article number107003
Number of pages14
JournalEngineering Fracture Mechanics
Volume230
DOIs
Publication statusPublished - 1 May 2020

Bibliographical note

Publisher Copyright:
© 2020 Elsevier Ltd

Keywords

  • fracture mechanics
  • heat
  • piezoelectric devices
  • piezoelectricity
  • thermal stresses

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